PCB fabrication
   etching
      ferric/cupric chloride, ammonium/sodium persulfate
      MSDS
      waste disposal
   machining
      tools
         0.010
         1/64
         1/32
      fixturing
      orientation
      zeroing
      lifetime
      deburring
      cleaning
   cutting
   printing
   plating
   sewing

PCB materials
   rigid
      FR4 (epoxy glass)
      FR1 (phenolic paper)
   flex
      Kapton
      #1 epoxy film, #1126 copper tape
   high-frequency
      teflon
      glass
   copper
      0.5 oz: 17.5 um
      1.0 oz: 35 um
      2.0 oz: 70 um

board houses
   AP Circuits, Advanced, Sierra, Screaming Circuits, Gold Phoenix
   design rules
      width/spacing (15, 5 mils)
   layers
      1, 1.5, 2, 4, N
   solder mask, silk screen
   vias
      blind, buried

components
   through-hole
   surface-mount
   chip-scale

breadboards

assembly
   solder
      eutectic
      wetting
      flux
      wire, paste, bar
      ROHS
   desoldering
      braid
      hot air
      gravity
   reflow
   wave
   stuffing
      component orientation
      tacking down parts
      bottom to top, inside to outside
      fumes
      washing
   pick-and-place
   encapsulation

CAM
   fab modules
   
assignment
   make the FabISP in-circuit programmer David Andy Valentin
      hello.ISP.44.cad board components traces interior
         hello.ISP.44.res.cad board traces interior
      inventory microcontroller crystal USB connector ribbon connector Zener diode jumper
      firmware.zip
         USB power
         make clean
         make hex
         (sudo) make fuse (check programmer in Makefile, may need to repeat)
         (sudo) make program
         desolder SJ1 and SJ2
         make IDC ISP cable, connecting header pin 1 to pin 1